Data communications cable for communicating data and power via optical and electrical signals

ABSTRACT

A data communication system is disclosed including a cable medium and modulator adapted to carry data and power between a high speed data source and a high speed data sink. Relatively high speed data (e.g. the TMDS data of an HDMI interface) may be carried on optical waveguides in the cable medium. Relatively low-speed data (e.g., DDC data and clock, and CEC of an HDMI interface) may be carried on a separate set of optical waveguides or wire mediums. The optical waveguides allow for substantially less signal distortion of the high-speed data, thereby allowing the cable medium to achieve much higher lengths without significantly affecting the high-speed signaling.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.14/581,667, filed on Dec. 23, 2014, entitled “Optical CommunicationMount for Mounting and Aligning Optical Fibers with Photo Devices,”which, in turn, is a divisional of U.S. patent application Ser. No.13/627,911, filed on Sep. 26, 2012, entitled, “System and Method forCommunicating Optical Signals via Communication Cable Medium,” now U.S.Pat. No. 8,948,197 B2, which, in turn, claims priority to the filingdates of U.S. Provisional Applications, Ser. Nos.: i) 61/540,461, filedon Sep. 28, 2011; ii) 61/543,695, filed on Oct. 5, 2011; iii) 61/543,668filed on Oct. 5, 2011; iv) 61/543,738, filed on Oct. 5, 2011; and v)61/543,722, filed on Oct. 5, 2011, all of which are herein incorporatedby reference.

FIELD

This disclosure relates generally to data communication mediums, and inparticular, to a system and method for communicating data and powerusing optical and electrical integrated medium.

BACKGROUND

Consumer multimedia systems of today typically consists of one or morevideo and audio (V/A) sources communicatively coupled to one or more V/Asinks. Examples of V/A sources include DVD players, Blu-ray players,set-top boxes, camcorders, game consoles, personal computers, andothers. Examples of V/A sinks include televisions, personal computers,projectors, audio devices, and others. Typically, standardizedinterfaces, in the form of cables, are used to communicatively coupleV/A sources to V/A sinks.

One such standardized interface is the High-Definition MultimediaInterface, more often referred to simply as HDMI. An HDMI interfacegenerally consists of two identical connectors attached to opposite endsof a cable. The cable typically includes seven (7) twisted pairs ofcopper wires for communicating various information. Four of the twistedwire pairs are adapted to communicate relatively high-speed data in theform of Transition Minimized Differential Signaling (TMDS). Of the four,three pairs are used for communicating video, audio, and auxiliary data,and are typically referred to as D1-D3. The other pair is used fortransmitting a clock associated with the data, and is typically referredto as CLK. The speed of the high-speed data may range from 3 to 10gigabytes per second (GPS).

The remaining three wire pairs are used for communicating relativelylow-speed data, such as in the range of 100 kilobits per second (kbit/s)to 400 kbit/s. Two of such wire pairs are referred to as Display DataChannel (DDC) for providing communication between devices using acommunication channel that adheres to an I²C bus specification. As anexample, a V/A source may use the DDC to learn the video/audio formatused by a corresponding V/A sink. One of the DDC wire pair, typicallyreferred to as DDC DATA, is used to communicate data between thedevices. The other DDC wire pair, typically referred to as DDC CLK, isused to transmit a clock associated with the data.

The remaining twisted wire pair for low-speed data is used forcommunicating remote control commands between the devices. Such datachannel is typically referred to as Consumer Electronics Control (CEC).The CEC channel allows a user to use a single remote to control multipledevices coupled together via HDMI cables. More specifically, a uniqueaddress is assigned to the connected group of devices, which is used forsending remote control commands to the devices.

A drawback of the conventional HDMI is that length of the cable istypically limited to a relatively short distance. This is becausedistortion of the signal propagating through a twisted wire pair issignificantly dependent on the length of the cable. At large lengths,the distortion of the signal may be so significant that the signal maynot be able to be properly received by a V/A sink.

Optical communication systems use modulated optical electromagneticenergy or light to communicate information from one device to another.In such systems, one or more optical fibers are used to communicativelycouple the devices. Further, at the transmission-side of suchcommunication systems, an optical modulator is employed to modulateinformation in the form of an electrical signal onto optical energy.Typically, one or more vertical-cavity surface-emitting lasers (VCSELs)are used to perform the modulation. Similarly, at the reception-side ofsuch communication systems, an optical demodulator is employed todemodulate information on the optical energy to produce aninformation-bearing electrical signal. Typically, one or more photodetectors (PDs) are used to perform the demodulation.

A VCSEL of an optical transmitter should be optically aligned with acorresponding optical waveguide or fiber in order for the optical signalto be efficiently coupled to the optical waveguide or optical fiber fortransmission. Similarly, a PD of an optical receiver should be opticallyaligned with a corresponding optical waveguide or optical fiber in orderto efficiently receive or detect the optical energy being received viathe optical waveguide or optical fiber. Additionally, with regard toboth VCSEL and PD, bias voltage needs to be provided to the devices inorder for them to function.

Accordingly, there is a need for an HDMI or other data interface that isable to achieve lower signal distortion through the cable, therebyallowing the cable to be longer without significantly affecting thesignals. Additionally, there is a need for such an interface to providepower as well. Further, there is a need to provide an indication poweris available from either a V/A source or a V/A sink.

There is also a need for a mechanical assembly or mount to provideeffective alignment of a VCSEL or PD with a corresponding opticalwaveguide or optical fiber, while at the same time, effectuating thenecessary electrical routing for providing a bias voltage to suchdevice.

SUMMARY

An aspect of the disclosure relates to a data communication cablemedium, comprising a cable with optical waveguides for carryingrelatively high-speed data from a high speed data source (e.g. DVDplayers, Blu-ray players, set-top boxes, camcorders, game consoles,personal computers, and others) to a high speed data sink (e.g.televisions, personal computers, projectors, audio devices etc). Thecable medium may further include optical modulator and demodulator inorder to convert the high-speed data from an electrical domain to anoptical domain, and vice-versa.

In another aspect of the disclosure, the cable medium comprises one ormore optical waveguides to carry the relatively high speed data and oneor more wire mediums to carry relatively low speed data. An example ofrelatively high speed data is the TMDS data of an HDMI interface. Anexample of relatively low speed data is the DDC data and clock, and CECof an HDMI interface. The cable medium may include a pair ofmultiplexer/demultiplexer at respective ends of the cable to multiplexand demultiplex two or more of the relatively low-speed data types toand from one or more wire mediums.

In another aspect of the disclosure, the cable medium comprises one ormore optical waveguides to carry the relatively high speed data and oneor more wire mediums to carry relatively low speed data and powersignals. The cable medium may include a pair ofmultiplexer/demultiplexer at respective ends of the cable to multiplexand demultiplex two or more of the relatively low-speed data types toand from one or more wire mediums. The cable medium may include anotherpair of multiplexer/demultiplexer at respective ends of the cable tomultiplex and demultiplex a relatively low-speed data type with a powersignal to and from one or more wire mediums. The cable medium mayfurther comprise one or more detectors to generate an indication as tothe presence of the power signal, and may comprise one or more ports(e.g., USB port) configured to receive or produce the power signals(e.g., +5V and GND).

In another aspect of the disclosure the cable medium comprises one ormore optical waveguides for carrying the relatively high speed data andone or more separate optical fibers for carrying relatively low speeddata. Arbiters at both ends of the cable may prevent collision of thelow-speed data, as the low speed data may be sent bi-directionally.

In another aspect of the disclosure, an optical communication mount isprovided which facilitates the surface mounting of optical transmitters,receivers or transceivers. The optical communication mount comprises ahousing including one or more thru-holes extending from a first side ofthe housing to a second side of the housing, a first set of one or moreelectrically-conductive traces disposed on a bottom side of the housing,and a second set of one or more electrically-conductive traces disposedon the front side of the housing. The optical communication mountfurther comprises one or more optical fibers extending into the one ormore thru-holes from the second side of the housing. Additionally, theoptical communication mount further comprises one or more photo devicessubstantially registered with the one or more thru-holes at the frontside of the housing in a manner to receive and/or transmit one or moreoptical signals by way of the one or more optical fibers, and whereinthe one or more photo devices are configured to receive one or more biasvoltages by way of the second set of one or more electrically-conductivetraces, respectively.

Other aspects, advantages and novel features of the present disclosurewill become apparent from the following detailed description whenconsidered in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a schematic/block diagram of an exemplary datacommunication cable medium in accordance with an aspect of thedisclosure.

FIG. 2 illustrates a cross-sectional view of an exemplary cable inaccordance with another aspect of the disclosure.

FIG. 3 illustrates a cross-sectional view of another exemplary cable inaccordance with another aspect of the disclosure.

FIG. 4 illustrates a schematic/block diagram of an exemplary datacommunication cable medium in accordance with an aspect of thedisclosure.

FIG. 5 illustrates a cross-sectional view of an exemplary cable inaccordance with another aspect of the disclosure.

FIG. 6 illustrates a cross-sectional view of another exemplary cable inaccordance with another aspect of the disclosure.

FIG. 7 illustrates a cross-sectional view of yet another exemplary cablein accordance with another aspect of the disclosure.

FIG. 8 illustrates a schematic/block diagram of an exemplary datacommunication cable medium in accordance with an aspect of thedisclosure.

FIG. 9 illustrates a cross-sectional view of an exemplary cable inaccordance with another aspect of the disclosure.

FIG. 10 illustrates a cross-sectional view of another exemplary cable inaccordance with another aspect of the disclosure.

FIG. 11 illustrates a schematic/block diagram of an exemplary datacommunication cable medium in accordance with an aspect of thedisclosure.

FIG. 12 illustrates a cross-sectional view of an exemplary cable inaccordance with another aspect of the disclosure.

FIG. 13 illustrates a cross-sectional view of another exemplary cable inaccordance with another aspect of the disclosure.

FIG. 14 illustrates a cross-sectional view of yet another exemplarycable in accordance with another aspect of the disclosure.

FIG. 15 illustrates side, front and bottom views of an exemplary opticalcommunication mount in accordance with an aspect of the disclosure.

FIG. 16 illustrates a perspective view of an exemplary opticalcommunication system including an optical communication mount securelymounted on a printed circuit board (PCB) or substrate in accordance withanother aspect of the disclosure.

FIG. 17A illustrates a perspective view of a photo detector (PD) orvertical-cavity surface-emitting laser (VCSEL) array in accordance withanother aspect of the disclosure.

FIG. 17B illustrates a perspective view of an exemplary opticalcommunication system including an optical communication mount with a PDor VCSEL array device mounted thereon, and securely disposed on a PCB orsubstrate in accordance with another aspect of the disclosure.

FIG. 18 illustrates side and front views of another exemplary opticalcommunication mount in accordance with another aspect of the disclosure.

FIG. 19 illustrates side and front views of yet another exemplaryoptical communication mount in accordance with another aspect of thedisclosure.

FIG. 20 illustrates front and bottom views of still another exemplaryoptical communication mount in accordance with another aspect of thedisclosure.

FIG. 21 illustrates front and bottom views of an additional exemplaryoptical communication mount in accordance with another aspect of thedisclosure.

FIG. 22 illustrates side and bottom views of a further exemplary opticalcommunication mount in accordance with another aspect of the disclosure.

FIG. 23A-23D illustrate top views of an exemplary wafer at variousstages of an exemplary method of manufacturing an optical communicationmount in accordance with another aspect of the disclosure.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

Hybrid Data Communication Cable Medium

FIG. 1 illustrates a schematic/block diagram of an exemplary datacommunication cable medium 100 in accordance with an aspect of thedisclosure. In summary, the data communication cable medium 100comprises a plurality of optical waveguides (e.g., optical fibers)through which relatively high-speed data (e.g., the TMDS data of an HDMIinterface) are communicated, and a plurality of electrical wires throughwhich relatively low-speed data (e.g., DDC data and clock, and CEC of anHDMI interface) are communicated. The optical waveguides result insubstantially less signal distortion of the high-speed data, therebyallowing the cable medium 100 to achieve much higher lengths withoutsignificantly affecting the high-speed signaling.

More specifically, with reference to FIG. 1, the data communicationcable medium 100 comprises a cable 120, a first connector 110 coupled toan end of the cable 120, and a second connector 140 coupled to anopposite end of the cable 120. The cable 120 comprises a plurality ofoptical waveguides (e.g., optical fibers) 122, 124, 126 and 128 forcommunicating relatively high-speed data from the first connector 110 tothe second connector 140. Additionally, the cable 120 comprises aplurality of wire mediums 130 and 132 for communicating relativelylow-speed data between the first connector 110 and the second connector140.

The first connector 110 is adapted to mate with a correspondingconnector of a source of relatively high-speed data, such as a DVDplayer, Blu-Ray player, and others as previously indicated. The firstconnector 110 comprises a first set of electrical contacts adapted toreceive relatively high-speed data, such as the TMDS data (D1-D3 andCLK) of an HDMI interface. The first connector 110 further comprises asecond set of electrical contacts adapted to receive and/or producerelatively low-speed data, such as the DDC DATA, DDC CLK, and CEC of anHDMI interface. The first and second sets of electrical contacts of thefirst connector 110 may be configured substantially the same as astandard HDMI connector.

The first connector 110 further comprises an optical modulator 112adapted to modulate the high-speed data received via the electricalcontacts onto respective optical carriers for transmission via opticalwaveguides 122, 124, 126, and 128, respectively. For example, withreference to an HDMI interface, the optical modulator is adapted tomodulate the TMDS data (e.g., D1-D3 and CLK) onto respective opticalcarriers for transmission via optical waveguides 122, 124, 126 and 128,respectively.

The first connector 110 also comprises a multiplexer/demultiplexer 114adapted to multiplex relatively low-speed data (being communicated fromthe high-speed data source to the high-speed data sink) onto the wiremedium 132 of the cable 120. For example, with reference to an HDMIinterface, the multiplexer/demultiplexer 114 is adapted to multiplex theDDC CLK and CEC onto the wire medium 132.

Similarly, the multiplexer/demultiplexer 114 is adapted to demultiplexrelatively low-speed data (being communicated from the high-speed datasink to the high-speed data source) from the wire medium 132 of thecable 120 to electrical contacts of the first connector 110. Forexample, with reference to an HDMI interface, themultiplexer/demultiplexer 114 is adapted to demultiplex the DDC CLK andCEC from the wire medium 132 to the corresponding electrical contacts.

Some of the low speed data may be coupled directly via a wire mediumfrom the first connector 110 to the second connector 140 by way of thecable. For instance, the first connector 110 may directly couple the DDCDATA electrical contact to the wire medium 130 of the cable 120.Similarly, the second connector 140 may directly couple the wire medium130 of the cable 120 to the corresponding DDC DATA electrical contact ofthe second connector 140.

The second connector 140 is adapted to mate with a correspondingconnector of a sink of the relatively high-speed data, such as atelevision, projector, computer, and others as previously indicated. Thesecond connector 140 comprises a first set of electrical contactsadapted to produce the relatively high-speed data, such as the TMDS data(D1-D3 and CLK) of an HDMI interface. The second connector 140 furthercomprises a second set of electrical contacts adapted to receive and/orproduce the relatively low-speed data, such as the DDC DATA, DDC CLK,and CEC of an HDMI interface. The first and second sets of electricalcontacts of the second connector 140 may be configured substantially thesame as a standard HDMI connector.

The second connector 140 further comprises an optical demodulator 142adapted to demodulate the high-speed data on optical carriers receivedvia optical waveguides 122, 124, 126, and 128 to correspondingelectrical contacts, respectively. For example, with reference to anHDMI interface, the optical demodulator is adapted to demodulate theTMDS data (e.g., D1-D3 and CLK) from the optical waveguides 122, 124,126 and 128 to corresponding electrical contacts, respectively.

The second connector 140 also comprises a multiplexer/demultiplexer 144adapted to multiplex relatively low-speed data (being communicated fromthe high-speed data sink to the high-speed data source) onto the wiremedium 132 of the cable 120. For example, with reference to an HDMIinterface, the multiplexer/demultiplexer 144 is adapted to multiplex theDDC CLK and CEC onto the wire medium 132.

Similarly, the multiplexer/demultiplexer 144 is adapted to demultiplexrelatively low-speed data (being communicated from the high-speed datasource to the high-speed data sink) from the wire medium 132 of thecable 120 to corresponding electrical contacts of the second connector140. For example, with reference to an HDMI interface, themultiplexer/demultiplexer 144 is adapted to demultiplex the DDC CLK andCEC from the wire medium 132 to the corresponding electrical contacts.

Although an HDMI interface is used to exemplify the configuration of thedata communication cable medium 100, it shall be understood that thecable medium 100 may be adapted to transmit high- and low-speed data ofother protocols using the combination of optical waveguides and wires.Further, although the optical modulator 112 andmultiplexer/demultiplexer 114 have been described as being incorporatedinto the first connector 110, it shall be understood that thesecomponents may be housed separately from the first connector, such as ina separate housing situated between the first connector 110 and thecable 120. Similarly, although the optical demodulator 142 andmultiplexer/demultiplexer 144 have been described as being incorporatedinto the second connector 140, it shall be understood that thesecomponents may be housed separately from the second connector, such asin a separate housing situated between the cable 120 and the secondconnector 140.

FIG. 2 illustrates a cross-sectional view of an exemplary cable 200 inaccordance with another aspect of the disclosure. The cable 200 may beone example of an implementation of the cable 120 previously discussed.In particular, the cable 200 comprises a housing or enclosure 202. Astypical of cables, the housing or enclosure 202 may be comprised ofbendable material to facilitate the routing of the cable 200 alongcurved paths. The cable 202 includes a couple of internal walls 204 toseparate the various physical communication mediums disposed therein.

The cable 202 further comprises a plurality of optical waveguides 208(e.g., optical fibers) for communicating the relatively high-speed data,as previously discussed. As shown, the optical waveguides 208 aresituated within a centrally-located compartment within the cable 200,which is defined by the two internal walls 204 and the housing orenclosure 202. The cable 200 further comprises electrical wires 206 forcommunicating the relatively low-speed data, as previously discussed.The electrical wires 206 are positioned within their own compartments,both defined by a corresponding the internal wall 204 and the housing orenclosure 202. It shall be understood that the cable 200 may beconfigured differently to effectuate the routing of the opticalwaveguides and electrical wires, as previously discussed.

FIG. 3 illustrates a cross-sectional view of another exemplary cable 300in accordance with another aspect of the disclosure. The cable 300 maybe another example of an implementation of the cable 120 previouslydiscussed. In particular, the cable 300 comprises a housing or enclosure302. As typical of cables, the housing or enclosure 302 may be comprisedof bendable material to facilitate the routing of the cable 300 alongcurved paths. The cable 302 includes a couple of internal walls 304 toseparate the various physical communication mediums disposed therein.

The cable 302 further comprises a plurality of optical waveguides 308(e.g., optical fibers) for communicating the relatively high-speed data,as previously discussed. As shown, the optical waveguides 308 may bearranged as a single row array and situated within a centrally-locatedcompartment within the cable 300, which is defined by the two internalwalls 304 and the housing or enclosure 302. The cable 300 furthercomprises electrical wires 306 for communicating the relativelylow-speed data, as previously discussed. The electrical wires 306 arepositioned within their own compartments, both defined by acorresponding the internal wall 304 and the housing or enclosure 302. Itshall be understood that the cable 300 may be configured differently toeffectuate the routing of the optical waveguides and electrical wires,as previously discussed.

Hybrid Data and Power Communication Cable Medium

FIG. 4 illustrates a schematic/block diagram of an exemplary datacommunication cable medium 400 in accordance with an aspect of thedisclosure. In summary, the data communication cable medium 400comprises a plurality of optical waveguides (e.g., optical fibers)through which relatively high-speed data (e.g., the TMDS data of an HDMIinterface) are communicated, and a plurality of electrical wires throughwhich relatively low-speed data (e.g., DDC data and clock, and CEC of anHDMI interface) and power (e.g., 5 Volts and Ground) are communicated.The optical waveguides result in substantially less signal distortion ofthe high-speed data, thereby allowing the cable medium 400 to achievemuch higher lengths without significantly affecting the high-speedsignaling. The transmitted power allows one device to provide power toanother device by way of the cable medium 400.

In particular, with reference to FIG. 4, the data communication cablemedium 400 comprises a cable 420, a first connector 410 coupled to anend of the cable 420, and a second connector 440 coupled to an oppositeend of the cable 420. The cable 420 comprises a plurality of opticalwaveguides (e.g., optical fibers) 422, 424, 426 and 428 forcommunicating relatively high-speed data from the first connector 410 tothe second connector 440. Additionally, the cable 420 comprises aplurality of wire mediums 432, 433 and 434 for communicating relativelylow-speed data and power between the first connector 410 and the secondconnector 440.

The first connector 410 is adapted to mate with a correspondingconnector of a source of relatively high-speed data, such as a DVDplayer, Blu-ray player, and others as previously indicated. The firstconnector 410 comprises a first set of electrical contacts adapted toreceive relatively high-speed data, such as the TMDS data (D1-D3 andCLK) of an HDMI interface. The first connector 410 further comprises asecond set of electrical contacts adapted to receive and/or producerelatively low-speed data, such as the DDC DATA, DDC CLK, and CEC of anHDMI interface. The first and second sets of electrical contacts of thefirst connector 410 may be configured substantially the same as astandard HDMI connector. Additionally, the first connector 410 comprisesa third set of electrical contacts adapted to receive or produce power(e.g., 5 Volts) and ground (GND).

The first connector 410 further comprises an optical modulator 412adapted to modulate the high-speed data received via the first set ofelectrical contacts onto respective optical carriers for transmissionvia optical waveguides 422, 424, 426, and 428, respectively. Forexample, with reference to an HDMI interface, the optical modulator 412is adapted to modulate the TMDS data (e.g., D1-D3 and CLK) ontorespective optical carriers for transmission via optical waveguides 422,424, 426 and 428, respectively. The modulating of the data ontorespective optical carriers may be accomplished by directly modulatingvertical-cavity surface emitting laser (VCSEL) devices.

The first connector 410 further comprises a firstmultiplexer/demultiplexer 414 adapted to multiplex low-speed data andpower (being communicated from the high-speed data source to thehigh-speed data sink) onto the wire medium 432 for transmission to thesecond connector 440. For example, with reference to an HDMI interface,the first multiplexer/demultiplexer 414 is adapted to multiplex the DDCDATA and power (e.g., 5 Volts) onto the wire medium 432. Similarly, thefirst multiplexer/demultiplexer 414 is adapted to demultiplex relativelylow-speed data and power (being communicated from the high-speed datasink to the high-speed data source) from the wire medium 432 of thecable 420 to corresponding electrical contacts of the first connector410. For example, with reference to an HDMI interface, the firstmultiplexer/demultiplexer 414 is adapted to demultiplex the DDC DATA andpower (e.g., 5 Volts) from the wire medium 432 to the correspondingelectrical contacts. It shall be understood that the DDC data and powerneed not be transmitted in the same direction.

The first connector 410 also comprises a secondmultiplexer/demultiplexer 416 adapted to multiplex other relativelylow-speed data (being communicated from the high-speed data source tothe high-speed data sink) onto the wire medium 434 of the cable 420. Forexample, with reference to an HDMI interface, the secondmultiplexer/demultiplexer 416 is adapted to multiplex the DDC CLK andCEC onto the wire medium 434 for transmission to the second connector440. Similarly, the second multiplexer/demultiplexer 416 is adapted todemultiplex relatively low-speed data (being communicated from thehigh-speed data sink to the high-speed data source) from the wire medium434 of the cable 420 to corresponding electrical contacts of the firstconnector 410. For example, with reference to an HDMI interface, thesecond multiplexer/demultiplexer 416 is adapted to demultiplex the DDCCLK and CEC from the wire medium 434 to the corresponding electricalcontacts.

The ground potential, associated with the communicated power, may becoupled directly via a wire medium from the first connector 410 to thesecond connector 440 by way of the cable 420. For instance, the firstconnector 410 may directly couple the ground electrical contact to thewire medium 433 of the cable 420. Similarly, the second connector 440may directly couple the wire medium 433 of the cable 420 to thecorresponding ground electrical contact.

The second connector 440 is adapted to mate with a correspondingconnector of a sink of the relatively high-speed data, such as atelevision, projector, computer, and others as previously indicated. Thesecond connector 440 comprises a first set of electrical contactsadapted to produce the relatively high-speed data, such as the TMDS data(D1-D3 and CLK) of an HDMI interface. The second connector 440 furthercomprises a second set of electrical contacts adapted to receive and/orproduce the relatively low-speed data, such as the DDC DATA, DDC CLK,and CEC of an HDMI interface. The first and second sets of electricalcontacts of the second connector 440 may be configured substantially thesame as a standard HDMI connector. Additionally, the second connector440 comprises a third set of electrical contacts adapted to receive orproduce power (e.g., 5 Volts) and ground (GND).

The second connector 440 further comprises an optical demodulator 442adapted to demodulate the high-speed data on optical carriers receivedvia optical waveguides 422, 424, 426, and 428 to correspondingelectrical contacts, respectively. For example, with reference to anHDMI interface, the optical demodulator 442 is adapted to demodulate theTMDS data (e.g., D1-D3 and CLK) from the optical waveguides 422, 424,426 and 428 to corresponding electrical contacts, respectively. Thedemodulating of the data from the optical carriers may be accomplishedby PIN photodiodes with receiving circuitry (transimpedance amplifier(TIA)).

The second connector 440 further comprises a firstmultiplexer/demultiplexer 444 adapted to multiplex low-speed data andpower (being communicated from the high-speed data sink to thehigh-speed data source) onto the wire medium 432 for transmission to thefirst connector 410. For example, with reference to an HDMI interface,the first multiplexer/demultiplexer 444 is adapted to multiplex the DDCDATA and power (e.g., 5 Volts) onto the wire medium 432. Similarly, thefirst multiplexer/demultiplexer 444 is adapted to demultiplex relativelylow-speed data and power (being communicated from the high-speed datasource to the high-speed data sink) from the wire medium 432 of thecable 420 to corresponding electrical contacts of the second connector440. For example, with reference to an HDMI interface, the firstmultiplexer/demultiplexer 444 is adapted to demultiplex the DDC DATA andpower (e.g., 5 Volts) from the wire medium 432 to the correspondingelectrical contacts. As discussed above, it shall be understood that theDDC data and power need not be transmitted in the same direction.

The second connector 440 also comprises a secondmultiplexer/demultiplexer 446 adapted to multiplex relatively low-speeddata (being communicated from the high-speed data sink to the high-speeddata source) onto the wire medium 434 of the cable 420. For example,with reference to an HDMI interface, the secondmultiplexer/demultiplexer 446 is adapted to multiplex the DDC CLK andCEC onto the wire medium 434. Similarly, the secondmultiplexer/demultiplexer 446 is adapted to demultiplex relativelylow-speed data (being communicated from the high-speed data source tothe high-speed data sink) from the wire medium 434 of the cable 420 tocorresponding electrical contacts of the second connector 440. Forexample, with reference to an HDMI interface, the secondmultiplexer/demultiplexer 446 is adapted to demultiplex the DDC CLK andCEC from the wire medium 434 to the corresponding electrical contacts.

Although an HDMI interface is used to exemplify the configuration of thedata communication cable medium 400, it shall be understood that thecable medium 400 may be adapted to transmit high- and low-speed data andpower using the combination of optical waveguides and wires. Further,although the optical modulator 412 and first and secondmultiplexer/demultiplexer 414 and 416 have been described as beingincorporated into the first connector 410, it shall be understood thatthese components may be housed separately from the first connector, suchas in a separate housing situated between the first connector 410 andthe cable 420. Similarly, although the optical demodulator 442 and firstand second multiplexer/demultiplexer 444 and 446 have been described asbeing incorporated into the second connector 440, it shall be understoodthat these components may be housed separately from the secondconnector, such as in a separate housing situated between the cable 420and the second connector 440.

FIG. 5 illustrates a cross-sectional view of an exemplary cable 500 inaccordance with another aspect of the disclosure. The cable 500 may beone example of an implementation of the cable 420 previously discussed.In particular, the cable 500 comprises a housing or enclosure 502. Astypical of cables, the housing or enclosure 502 may be comprised ofbendable material to facilitate the routing of the cable 500 alongcurved paths. The cable 502 includes internal walls 504 to separate thevarious physical communication mediums disposed therein.

The cable 500 further comprises a plurality of optical waveguides 508(e.g., optical fibers) for communicating the relatively high-speed data,as previously discussed. As shown, the optical waveguides 508 aresituated within upper and lower centrally-located compartments withinthe cable 500, which are defined by the two internal walls 504 and thehousing or enclosure 502. The cable 500 further comprises electricalwires 506 for communicating the relatively low-speed data, power andground, as previously discussed. The electrical wires 506 are positionedwithin their own compartments, two of which are defined by acorresponding internal wall 504 and the housing or enclosure 502, andthe other is centrally-located within the housing 502, being definedexclusively by the internal walls 504. It shall be understood that thecable 500 may be configured differently to effectuate the routing of theoptical waveguides and electrical wires, as previously discussed.

FIG. 6 illustrates a cross-sectional view of another exemplary cable 600in accordance with another aspect of the disclosure. The cable 600 maybe another example of an implementation of the cable 420 previouslydiscussed. In particular, the cable 600 comprises a housing or enclosure602. As typical of cables, the housing or enclosure 602 may be comprisedof bendable material to facilitate the routing of the cable 600 alongcurved paths. The cable 602 includes internal walls 304 to separate thevarious physical communication mediums disposed therein.

The cable 600 further comprises a plurality of optical waveguides 608(e.g., optical fibers) for communicating the relatively high-speed data,as previously discussed. As shown, the optical waveguides 608 aresituated within a centrally-located compartment within the cable 600,which is defined by two internal walls 604 and the housing or enclosure602. The cable 600 further comprises electrical wires 606 forcommunicating the relatively low-speed data, power and ground, aspreviously discussed. A pair of the electrical wires 606 may bepositioned within a leftward-located compartment defined by the leftinternal wall 604 and the housing or enclosure 602. The other electricalwire 606 may be positioned within a rightward-located compartmentdefined by the right internal wall 604 and the housing or enclosure 602.Filler material 610 may be provided within the cable 600 to providemechanical stability of the communication mediums 606 and 608. It shallbe understood that the cable 600 may be configured differently toeffectuate the routing of the optical waveguides and electrical wires,as previously discussed.

FIG. 7 illustrates a cross-sectional view of yet another exemplary cable700 in accordance with another aspect of the disclosure. The cable 700may be another example of an implementation of a modified version of thecable 420 previously discussed. In particular, the cable 700 comprises ahousing or enclosure 702. As typical of cables, the housing or enclosure702 may be comprised of bendable material to facilitate the routing ofthe cable 700 along curved paths. The cable 702 includes internal walls704 to separate the various physical communication mediums disposedtherein.

The cable 700 further comprises a plurality of optical waveguides 708(e.g., optical fibers) for communicating the relatively high-speed data,as previously discussed. As shown, the optical waveguides 708 aresituated within a centrally-located compartment within the cable 700,which is defined by two internal walls 704 and the housing or enclosure702. The cable 700 further comprises electrical wires 706 forcommunicating the relatively low-speed data, power and ground, aspreviously discussed. A pair of the electrical wires 706, forcommunicating the DDC DATA/power and ground, may be positioned within aleftward-located compartment defined by the left internal wall 704 andthe housing or enclosure 702.

The other pair of the electrical wires 706, for communicating the DDCCLK and CEC, may be positioned within a rightward-located compartmentdefined by the left internal wall 704 and the housing or enclosure 702.Note that this embodiment may not require the multiplexer/demultiplexer416 and 446, since these two types of information is being communicatedwith respective wire mediums. Filler material 710 may be provided withinthe cable 700 to provide mechanical stability of the communicationmediums 706 and 708. It shall be understood that the cable 700 may beconfigured differently to effectuate the routing of the opticalwaveguides and electrical wires, as previously discussed.

Optical Data Communication Cable Medium

FIG. 8 illustrates a schematic/block diagram of an exemplary datacommunication cable medium 800 in accordance with an aspect of thedisclosure. In summary, the data communication cable medium 800comprises a plurality of optical waveguides (e.g., optical fibers)through which relatively high-speed data (e.g., the TMDS of an HDMIinterface) and relatively low-speed data (e.g., DDC and CEC data of anHDMI interface) are communicated. The optical waveguides result insubstantially less signal distortion of the high-speed data, therebyallowing the cable medium 800 to achieve much higher lengths withoutsignificantly affecting the high-speed signaling.

In particular, with reference to FIG. 8, the data communication cablemedium 800 comprises a cable 820, a first connector 810 coupled to anend of the cable 820, and a second connector 840 coupled to an oppositeend of the cable 820. The cable 820 comprises a first set of opticalwaveguides (e.g., optical fibers) 822, 824, 826 and 828 forcommunicating relatively high-speed data from the first connector 810 tothe second connector 840. Additionally, the cable 820 comprises a secondset of optical waveguides 830 and 832 for communicating relativelylow-speed data between the first connector 810 and the second connector840. More specifically, the optical waveguide 830 is adapted tocommunicate relatively low-speed data from the first connector 810 tothe second connector 840, and the optical waveguide 832 is adapted tocommunicate relatively low-speed data from the second connector 840 tothe first connector 810.

The first connector 810 is adapted to mate with a correspondingconnector of a source of relatively high-speed data, such as a DVDplayer, Blu-ray player, and others as previously indicated. The firstconnector 810 comprises a first set of electrical contacts adapted toreceive relatively high-speed data, such as the TMDS data (D1-D3 andCLK) of an HDMI interface. The first connector 810 further comprises asecond set of electrical contacts adapted to receive and/or producerelatively low-speed data, such as the DDC DATA, DDC CLK, and CEC of anHDMI interface. The first and second sets of electrical contacts of thefirst connector 810 may be configured substantially the same as astandard HDMI connector.

The first connector 810 further comprises a high-speed optical modulator812 adapted to modulate the high-speed data received via the first setof electrical contacts onto respective optical carriers for transmissionvia optical waveguides 822, 824, 826, and 828, respectively. Forexample, with reference to an HDMI interface, the optical modulator 812is adapted to modulate the TMDS data (e.g., D1-D3 and CLK) ontorespective optical carriers for transmission via optical waveguides 822,824, 826 and 828, respectively.

The first connector 810 also comprises an arbiter 814, a low-speedoptical modulator 816, and a low-speed optical demodulator 818. Thearbiter 814 is adapted to arbitrate the transmission and reception ofthe low-speed data to and from the second set of electrical contacts, soas to prevent collision of the low-speed data being communicated fromthe first connector 810 to the second connector 840, with the low-speeddata being communicated from the second connector 840 to the firstconnector 810. For example, with reference to an HDMI interface, thearbiter 814 has to arbitrate between transmission and reception of theDDC DATA, DDC CLK and CEC to and from the second set of electricalcontacts.

The low-speed optical modulator 816, in turn, is adapted to modulate anoptical carrier with the relatively low-speed data received from thearbiter 814 for transmission from the first connector 810 to the secondconnector 840 by way of optical waveguide 830 of the cable 820. Forexample, with reference to an HDMI interface, the low-speed opticalmodulator 816 is adapted to modulate an optical carrier with the DDCDATA, DDC CLK, and CEC to an optical carrier for transmission to thesecond connector 840 by way of optical waveguide 830 of the cable 820.

Similarly, the low-speed optical demodulator 818 is adapted todemodulate relatively low-speed data from an optical carrier receivedfrom the second connector 840 by way of optical waveguide 832 of thecable 820. The low-speed optical demodulator 818 provides thedemodulated low-speed data to the arbiter 814. For example, withreference to an HDMI interface, the low-speed optical demodulator 818 isadapted to demodulate DDC DATA, DDC CLK and CEC from an optical carrierreceived from the second connector 840 by way of the optical waveguide832 of the cable 830.

The second connector 840 is adapted to mate with a correspondingconnector of a sink of the relatively high-speed data, such as atelevision, projector, computer, and others as previously indicated. Thesecond connector 840 comprises a first set of electrical contactsadapted to produce the relatively high-speed data, such as the TMDS data(D1-D3 and CLK) of an HDMI interface. The second connector 840 furthercomprises a second set of electrical contacts adapted to receive and/orproduce the relatively low-speed data, such as the DDC DATA, DDC CLK,and CEC of an HDMI interface. The first and second sets of electricalcontacts of the second connector 840 may be configured substantially thesame as a standard HDMI connector.

The second connector 840 further comprises an optical demodulator 842adapted to demodulate the high-speed data on optical carriers receivedvia optical waveguides 822, 824, 826, and 828 onto correspondingelectrical contacts, respectively. For example, with reference to anHDMI interface, the optical demodulator 842 is adapted to demodulate theTMDS data (e.g., D1-D3 and CLK) from the optical waveguides 822, 824,826 and 828 onto corresponding electrical contacts, respectively.

The second connector 840 also comprises an arbiter 844, a low-speedoptical demodulator 846, and a low-speed optical modulator 848. Thearbiter 844 is adapted to arbitrate the transmission and reception ofthe low-speed data to and from the second set of electrical contacts ofthe second connector 840, so as to prevent collision of the low-speeddata being communicated from the first connector 810 to the secondconnector 840, with the low-speed data being communicated from thesecond connector 840 to the first connector 810. For example, withreference to an HDMI interface, the arbiter 844 arbitrates betweentransmission and reception of the DDC DATA, DDC CLK and CEC to and fromthe second set of electrical contacts of the second connector 840.

The low-speed optical demodulator 846 is adapted to demodulaterelatively low-speed data from an optical carrier received from thefirst connector 810 by way of optical waveguide 830 of the cable 820.The low-speed optical demodulator 846 provides the demodulated low-speeddata to the arbiter 844. For example, with reference to an HDMIinterface, the low-speed optical demodulator 846 is adapted todemodulate DDC DATA, DDC CLK and CEC from an optical carrier receivedfrom the first connector 810 by way of the optical waveguide 830 of thecable 820.

Similarly, the low-speed optical modulator 848, in turn, is adapted tomodulate an optical carrier with the relatively low-speed data receivedfrom the arbiter 844 for transmission from the second connector 840 tothe first connector 810 by way of optical waveguide 832 of the cable820. For example, with reference to an HDMI interface, the low-speedoptical modulator 848 is adapted to modulate an optical carrier with theDDC DATA, DDC CLK, and CEC for transmission to the first connector 810by way of optical waveguide 832 of the cable 820.

Although an HDMI interface is used to exemplify the configuration of thedata communication cable medium 800, it shall be understood that thecable medium 800 may be adapted to transmit high- and low-speed data ofother protocols using the of optical waveguides. Further, although thehigh-speed optical modulator 812, arbiter 814, low-speed opticalmodulator 816 and low-speed optical demodulator 818 have been describedas being incorporated into the first connector 810, it shall beunderstood that these components may be housed separately from the firstconnector, such as in a separate housing situated between the firstconnector 810 and the cable 820. Similarly, although the high-speedoptical demodulator 842, arbiter 844, low-speed optical demodulator 846,and low-speed optical modulator 848 have been described as beingincorporated into the second connector 840, it shall be understood thatthese components may be housed separately from the second connector,such as in a separate housing situated between the cable 820 and thesecond connector 840.

FIG. 9 illustrates a cross-sectional view of an exemplary cable 900 inaccordance with another aspect of the disclosure. The cable 900 may beone example of an implementation of the cable 820 previously discussed.In particular, the cable 900 comprises a housing or enclosure 902. Astypical of cables, the housing or enclosure 902 may be comprised ofbendable material to facilitate the routing of the cable 900 alongcurved paths. The cable 900 further comprises a plurality of opticalwaveguides 904 (e.g., optical fibers) for communicating the relativelyhigh-speed and relatively low-speed data, as previously discussed. Thecable 900 may further provide filler material 906 in order to preventsubstantial movement of the optical waveguides 904 within the housing902 of the cable 900. It shall be understood that the cable 900 may beconfigured differently to effectuate the routing of the opticalwaveguides, as previously discussed.

FIG. 10 illustrates a cross-sectional view of another exemplary cable1000 in accordance with another aspect of the disclosure. The cable 1000may be one example of an implementation of the cable 820 previouslydiscussed. In particular, the cable 1000 comprises a housing orenclosure 1002. As typical of cables, the housing or enclosure 1002 maybe comprised of bendable material to facilitate the routing of the cable1000 along curved paths. The cable 1000 further comprises a plurality ofoptical waveguides 1004 (e.g., optical fibers) for communicating therelatively high-speed and relatively low-speed data, as previouslydiscussed. The optical waveguides 1004 may be arranged in a single rowarray as shown. The cable 1000 may further provide filler material 906in order to prevent substantial movement of the optical waveguides 1004within the housing 1002 of the cable 1000. It shall be understood thatthe cable 1000 may be configured differently to effectuate the routingof the optical waveguides, as previously discussed.

Hybrid Data and Power Communication Cable Medium with Power Indicator

FIG. 11 illustrates a schematic/block diagram of an exemplary datacommunication cable medium 1100 in accordance with an aspect of thedisclosure. In summary, the data communication cable medium 1100comprises a plurality of optical waveguides (e.g., optical fibers)through which relatively high-speed data (e.g., the TMDS data of an HDMIinterface) are communicated, and a plurality of electrical wires throughwhich relatively low-speed data (e.g., DDC data and clock, and CEC of anHDMI interface) and power (e.g., 5 Volts and Ground) are communicated.The optical waveguides result in substantially less signal distortion ofthe high-speed data, thereby allowing the cable medium 1100 to achievemuch higher lengths without significantly affecting the high-speedsignaling.

Continuing the summary, the data communication cable medium 1100provisioning for the transmission of power allows one device to providepower to another device by way of the cable medium 1100. Additionally,the cable medium 1100 includes circuitry for providing an indicationwhether power is available or not. Further, the cable medium 1100further comprises a port (e.g., a Universal Serial Bus (USB) port) forconnection to a third device that provides a source of power for thecable. Such a port may be provided at the respective connectors of thecable medium 1100, as described herein. Accordingly, if neither the V/Asource nor V/A sink attached to both connectors of the cable medium 1100have available power, via the port, power may be supplied by a thirddevice.

In particular, with reference to FIG. 11, the data communication cablemedium 1100 comprises a cable 1120, a first connector 1110 coupled to anend of the cable 1120, and a second connector 1140 coupled to anopposite end of the cable 1120. The cable 1120 comprises a plurality ofoptical waveguides (e.g., optical fibers) 1122, 1124, 1126 and 1128 forcommunicating relatively high-speed data from the first connector 1110to the second connector 1140. Additionally, the cable 1120 comprises aplurality of wire mediums 1132, 1134 and 1136 for communicatingrelatively low-speed data and power between the first connector 1110 andthe second connector 1140.

The first connector 1110 is adapted to mate with a correspondingconnector of a source of relatively high-speed data, such as a DVDplayer, Blu-ray player, and others as previously indicated. The firstconnector 1110 comprises a first set of electrical contacts adapted toreceive relatively high-speed data, such as the TMDS data (D1-D3 andCLK) of an HDMI interface. The first connector 1110 further comprises asecond set of electrical contacts adapted to receive and/or producerelatively low-speed data, such as the DDC DATA, DDC CLK, and CEC of anHDMI interface. The first and second sets of electrical contacts of thefirst connector 1110 may be configured substantially the same as astandard HDMI connector. Additionally, the first connector 1110comprises a third set of electrical contacts adapted to receive orproduce power (e.g., 5 Volts) and ground (GND).

The first connector 1110 further comprises an optical modulator 1112adapted to modulate the high-speed data received via the first set ofelectrical contacts onto respective optical carriers for transmissionvia optical waveguides 1122, 1124, 1126, and 1128, respectively. Forexample, with reference to an HDMI interface, the optical modulator 1112is adapted to modulate the TMDS data (e.g., D1-D3 and CLK) ontorespective optical carriers for transmission via optical waveguides1122, 1124, 1126 and 1128, respectively. The modulating of the data ontorespective optical carriers may be accomplished by directly modulatingvertical-cavity surface emitting laser (VCSEL) devices.

The first connector 1110 also comprises a firstmultiplexer/demultiplexer 1114 adapted to multiplex relatively low-speeddata (being communicated from the high-speed data source to thehigh-speed data sink) onto the wire medium 1132 of the cable 1120. Forexample, with reference to an HDMI interface, the firstmultiplexer/demultiplexer 1114 is adapted to multiplex the DDC CLK andCEC onto the wire medium 1132 for transmission to the second connector1140. Similarly, the first multiplexer/demultiplexer 1114 is adapted todemultiplex relatively low-speed data (being communicated from thehigh-speed data sink to the high-speed data source) from the wire medium1132 of the cable 1120 to corresponding electrical contacts of the firstconnector 1110. For example, with reference to an HDMI interface, thefirst multiplexer/demultiplexer 1114 is adapted to demultiplex the DDCCLK and CEC from the wire medium 1132 to the corresponding electricalcontacts.

The first connector 1110 further comprises a secondmultiplexer/demultiplexer 1116 adapted to multiplex low-speed data andpower (being communicated from the high-speed data source to thehigh-speed data sink) onto the wire medium 1134 for transmission to thesecond connector 1140. For example, with reference to an HDMI interface,the second multiplexer/demultiplexer 1116 is adapted to multiplex theDDC DATA and power (e.g., 5 Volts) onto the wire medium 1134. Similarly,the second multiplexer/demultiplexer 1116 is adapted to demultiplexrelatively low-speed data and power (being communicated from thehigh-speed data sink to the high-speed data source) from the wire medium1134 of the cable 1120 to corresponding electrical contacts of the firstconnector 1110. For example, with reference to an HDMI interface, thesecond multiplexer/demultiplexer 1116 is adapted to demultiplex the DDCDATA and power (e.g., 5 Volts) from the wire medium 1134 to thecorresponding electrical contacts. It shall be understood that the DDCdata and power need not be transmitted in the same direction.

The ground potential, associated with the communicated power, may becoupled directly via a wire medium from the first connector 1110 to thesecond connector 1140 by way of the cable 1120. For instance, the firstconnector 1110 may directly couple the ground electrical contact to thewire medium 1136 of the cable 1120. Similarly, the second connector 1140may directly couple the wire medium 1136 of the cable 1120 to thecorresponding ground electrical contact.

The first connector 1110 further comprises a port 1118 (e.g., a USB)adapted to receive a compatible connector (e.g., a USB connector) from athird device. The port 1118 includes an electrical contact coupled tothe power electrical contact of the first connector 1110. Thiselectrical contact is adapted to receive power from the third device viathe compatible connector. The port 1118 includes an electrical contactcoupled to the ground electrical contact of the first connector 1110.This electrical contact is adapted to receive ground potential from thethird device via the compatible connector. The first connector 1110further comprises a power detector 1117 adapted to provide an indication(e.g., turn on an LED) when available power is present or not.

The second connector 1140 is adapted to mate with a correspondingconnector of a sink of the relatively high-speed data, such as atelevision, projector, computer, and others as previously indicated. Thesecond connector 1140 comprises a first set of electrical contactsadapted to produce the relatively high-speed data, such as the TMDS data(D1-D3 and CLK) of an HDMI interface. The second connector 1140 furthercomprises a second set of electrical contacts adapted to receive and/orproduce the relatively low-speed data, such as the DDC DATA, DDC CLK,and CEC of an HDMI interface. The first and second sets of electricalcontacts of the second connector 1140 may be configured substantiallythe same as a standard HDMI connector. Additionally, the secondconnector 1140 comprises a third set of electrical contacts adapted toreceive or produce power (e.g., 5 Volts) and ground (GND).

The second connector 1140 further comprises an optical demodulator 1142adapted to demodulate the high-speed data on optical carriers receivedvia optical waveguides 1122, 1124, 1126, and 1128 to correspondingelectrical contacts, respectively. For example, with reference to anHDMI interface, the optical demodulator 1142 is adapted to demodulatethe TMDS data (e.g., D1-D3 and CLK) from the optical waveguides 1122,1124, 1126 and 1128 to corresponding electrical contacts, respectively.The demodulating of the data from the optical carriers may beaccomplished by PIN photodiodes with receiving circuitry (transimpedanceamplifier (TIA)).

The second connector 1140 also comprises a firstmultiplexer/demultiplexer 1144 adapted to multiplex relatively low-speeddata (being communicated from the high-speed data sink to the high-speeddata source) onto the wire medium 1132 of the cable 1120. For example,with reference to an HDMI interface, the secondmultiplexer/demultiplexer 1144 is adapted to multiplex the DDC CLK andCEC onto the wire medium 1132. Similarly, the firstmultiplexer/demultiplexer 1144 is adapted to demultiplex relativelylow-speed data (being communicated from the high-speed data source tothe high-speed data sink) from the wire medium 1132 of the cable 1120 tocorresponding electrical contacts of the second connector 1140. Forexample, with reference to an HDMI interface, the firstmultiplexer/demultiplexer 1144 is adapted to demultiplex the DDC CLK andCEC from the wire medium 1132 to the corresponding electrical contacts.

The second connector 1140 further comprises a secondmultiplexer/demultiplexer 1146 adapted to multiplex low-speed data andpower (being communicated from the high-speed data sink to thehigh-speed data source) onto the wire medium 1134 for transmission tothe first connector 1110. For example, with reference to an HDMIinterface, the second multiplexer/demultiplexer 1146 is adapted tomultiplex the DDC DATA and power (e.g., 5 Volts) onto the wire medium1134. Similarly, the second multiplexer/demultiplexer 1146 is adapted todemultiplex relatively low-speed data and power (being communicated fromthe high-speed data source to the high-speed data sink) from the wiremedium 1134 of the cable 1120 to corresponding electrical contacts ofthe second connector 1140. For example, with reference to an HDMIinterface, the second multiplexer/demultiplexer 1146 is adapted todemultiplex the DDC DATA and power (e.g., 5 Volts) from the wire medium1134 to the corresponding electrical contacts. As discussed above, itshall be understood that the DDC data and power need not be transmittedin the same direction.

The second connector 1140 further comprises a port 1148 (e.g., a USB)adapted to receive a compatible connector (e.g., a USB connector) from athird device. The port 1148 includes an electrical contact coupled tothe power electrical contact of the second connector 1140. Thiselectrical contact is adapted to receive power from the third device viathe compatible connector. The port 1148 includes an electrical contactcoupled to the ground electrical contact of the second connector 1140.This electrical contact is adapted to receive ground potential from thethird device via the compatible connector. The second connector 1140further comprises a power detector 1147 adapted to provide an indication(e.g., turn on an LED) when available power is present or not.

Although an HDMI interface is used to exemplify the configuration of thedata communication cable medium 1100, it shall be understood that thecable medium 1100 may be adapted to transmit high- and low-speed dataand power using the combination of optical waveguides and wires.Further, although the optical modulator 1112 and first and secondmultiplexer/demultiplexer 1114 and 1116 have been described as beingincorporated into the first connector 1110, it shall be understood thatthese components may be housed separately from the first connector, suchas in a separate housing situated between the first connector 1110 andthe cable 1120. Similarly, although the optical demodulator 1142 andfirst and second multiplexer/demultiplexer 1144 and 1146 have beendescribed as being incorporated into the second connector 1140, it shallbe understood that these components may be housed separately from thesecond connector, such as in a separate housing situated between thecable 1120 and the second connector 1140.

FIG. 12 illustrates a cross-sectional view of an exemplary cable 1200 inaccordance with another aspect of the disclosure. The cable 1200 may bean example of an implementation of the cable 1120 previously discussed.In particular, the cable 1200 comprises a housing or enclosure 1202. Astypical of cables, the housing or enclosure 1202 may be comprised ofbendable material to facilitate the routing of the cable 1200 alongcurved paths. The cable 1202 includes internal walls 1204 to separatethe various physical communication mediums disposed therein.

The cable 1200 further comprises a plurality of optical waveguides 1208(e.g., optical fibers) for communicating the relatively high-speed data,as previously discussed. As shown, the optical waveguides 1208 aresituated within a centrally-located compartment within the cable 1200,which is defined by two internal walls 1204 and the housing or enclosure1202. The cable 1200 further comprises electrical wires 1206 forcommunicating the relatively low-speed data, power and ground, aspreviously discussed. A pair of the electrical wires 1206 may bepositioned within a leftward-located compartment defined by the leftinternal wall 1204 and the housing or enclosure 1202. The otherelectrical wire 1206 may be positioned within a rightward-locatedcompartment defined by the right internal wall 1204 and the housing orenclosure 1202. Filler material 1210 may be provided within the cable1200 to provide mechanical stability of the communication mediums 1206and 1208. It shall be understood that the cable 1200 may be configureddifferently to effectuate the routing of the optical waveguides andelectrical wires, as previously discussed.

FIG. 13 illustrates a cross-sectional view of another exemplary cable1300 in accordance with another aspect of the disclosure. The cable 1300may be another example of an implementation of the cable 1120 previouslydiscussed. In particular, the cable 1300 comprises a housing orenclosure 1302. As typical of cables, the housing or enclosure 1302 maybe comprised of bendable material to facilitate the routing of the cable1300 along curved paths. The cable 1302 includes internal walls 1304 toseparate the various physical communication mediums disposed therein.

The cable 1300 further comprises a plurality of optical waveguides 1308(e.g., optical fibers) for communicating the relatively high-speed data,as previously discussed. As shown, the optical waveguides 1308 arearranged in a single row array, and situated within a centrally-locatedupper compartment within the cable 1300, which is defined by the twointernal walls 1304 and the housing or enclosure 1302. The cable 1300further comprises electrical wires 1306 for communicating the relativelylow-speed data, power and ground, as previously discussed. Theelectrical wires 1306 are positioned within their own compartmentsdefined by a corresponding internal wall 1304 and the housing orenclosure 1302. filler material 1310 may be provided within the cable1300 to provide mechanical stability of the communication mediums 1306and 1308. It shall be understood that the cable 1300 may be configureddifferently to effectuate the routing of the optical waveguides andelectrical wires, as previously discussed.

FIG. 14 illustrates a cross-sectional view of yet another exemplarycable 1400 in accordance with another aspect of the disclosure. Thecable 1400 may be another example of an implementation of a modifiedversion of the cable 1120 previously discussed. In particular, the cable1400 comprises a housing or enclosure 1402. As typical of cables, thehousing or enclosure 1402 may be comprised of bendable material tofacilitate the routing of the cable 1400 along curved paths. The cable1402 includes internal walls 1404 to separate the various physicalcommunication mediums disposed therein.

The cable 1400 further comprises a plurality of optical waveguides 1408(e.g., optical fibers) for communicating the relatively high-speed data,as previously discussed. As shown, the optical waveguides 1408 aresituated within a centrally-located compartment within the cable 1400,which is defined by two internal walls 1404 and the housing or enclosure1402. The cable 1400 further comprises electrical wires 1406 forcommunicating the relatively low-speed data, power and ground, aspreviously discussed. A pair of the electrical wires 1406, forcommunicating the DDC DATA/power and ground, may be positioned within aleftward-located compartment defined by the left internal wall 1404 andthe housing or enclosure 1402.

The other pair of the electrical wires 1406, for communicating the DDCCLK and CEC, may be positioned within a rightward-located compartmentdefined by the left internal wall 1404 and the housing or enclosure1402. Note that this embodiment may not require themultiplexer/demultiplexer 1116 and 1146, since these two types ofinformation are being communicated with respective wire mediums. Fillermaterial 1410 may be provided within the cable 1400 to providemechanical stability of the communication mediums 1406 and 1408. Itshall be understood that the cable 1400 may be configured differently toeffectuate the routing of the optical waveguides and electrical wires,as previously discussed.

Optical Communication Mount

FIG. 15 illustrates side, front and bottom views of an exemplary opticalcommunication mount 1500 in accordance with an aspect of the disclosure.In summary, the mount 1500 comprises a frame or housing that includesone or more thru-holes for receiving, via one side, one or more opticalfibers, respectively. One or more corresponding photo detectors (PDs)and/or vertical-cavity surface-emitting lasers (VCSELs) may bepositioned proximate the one or more thru-holes on the opposite side ofthe frame or housing so as to facilitate the reception and/ortransmission of optical signals communicated via the one or more opticalfibers.

Additionally, the frame or housing includes one or moreelectrically-conductive traces extending from proximate the one or morethru-holes on a front side of the frame or housing to a bottom side ofthe frame or housing. The portion of the one or moreelectrically-conductive traces on the bottom side of the frame orhousing are configured to make electrical contact with corresponding oneor more electrically-conductive traces on a printed circuit board (PCB)or substrate, respectively. Accordingly, the optical communication mount100 is configured as a surface-mount device. The one or moreelectrically-conductive traces facilitate routing one or more biasvoltages from a driver circuit mounted on a PCB or substrate to the oneor more PDs and/or VCSELs situated proximate the one or more thru-holesof the frame or housing.

More specifically, with reference to FIG. 15, the optical communicationmount 1500 comprises a frame or housing 1502 including one or morethru-holes 1504. The frame or housing 1502 may be formed of a substrate,such as a semiconductor or electrical-insulating substrate. Accordingly,the one or more thru-holes 1504 may be configured as one or more viaholes formed through the semiconductor or electrical-insulatingsubstrate 1502. The frame or housing 1502 further comprises one or moreelectrically-conductive traces 1506 extending from proximate the one ormore thru-holes 1504 on a front side of the frame or housing, to abottom side of the frame or housing. The one or moreelectrically-conductive traces 1506 may be formed of a suitablemetallization layer or other electrically-conductive material.

As discussed in more detail herein, the portion of the one or moreelectrically-conductive traces 1506 on the bottom side of the frame orhousing 1502 may be configured to electrically attach to one or moreelectrically-conductive traces on a PCB or substrate, respectively.Again, this facilitates the surface mounting of the opticalcommunication mount 1500 on a PCB or substrate. Also, as discussed inmore detail herein, one or more PDs and/or VCSELs, such as an array ofsuch devices, may be positioned proximate the thru-holes 1504 on thefront side, and concentrically aligned with the thru-holes. Accordingly,the one or more electrically-conductive traces 1506 are adapted to routea bias voltage or current to the one or more PDs and/or VCSELs from adriver circuit on a PCB or substrate.

The one or more thru-holes 1504 are adapted to receive one or moreoptical fibers from the back side of the optical communication mount1500. Accordingly, in order to efficiently receive and/or transmitsignals via the one or more optical fibers, one or more PDs and/orVCSELs are aligned with respect to the one or more thru-holes 1504 inorder to substantially maximize the reception and/or transmission ofoptical signals. The one or more optical fibers may be securely attachedto the frame or housing 1502 within the one or more thru-holes 1504 bysuitable adhesive and/or friction fit within the thru-holes. Asdiscussed in more detail herein, the one or more thru-holes 1504 may betapered or stepped in order to better effectuate the friction fit of theone or more optical fibers within the one or more thru-holes 1504,respectively.

FIG. 16 illustrates a perspective view of an optical communicationsystem 1600 including an exemplary optical communication mount 1620securely disposed on a PCB or substrate 1610 in accordance with anotheraspect of the disclosure. As in the previous embodiment, the mount 1620comprises a frame or housing 1622 including a plurality of thru-holes1624 extending from a front side to a rear side of the frame or housing.Additionally, the mount 1620 further comprises a plurality ofelectrically-conductive traces 1626 extending proximate the respectivethru-holes 1624 on the front side of the frame or housing 1622 to thebottom side of the frame or housing (the portion of theelectrically-conductive traces on the bottom side not being illustratedin this figure).

The optical communication mount 1620 is securely attached to the PCB orsubstrate 1610 in a manner such that the electrically-conductive traces1626 make electrical contact with corresponding electrically-conductivetraces 1612 on the PCB or substrate 1610. For instance, the portion ofthe electrically-conductive traces 1626 on the bottom side of the frameor housing 1622 may be attached to the correspondingelectrically-conductive traces 1612 on the PCB or substrate 1612 usingsolder, conductive epoxy, or by other techniques. The PCB or substrate1610 may include thereon a driver circuit 1640 for generating theappropriate bias voltage or current for the PD and/or VCSEL mounted onthe optical communication mount 1620, as further discussed herein. Forexample, the driver circuit 1640 may be a transimpedance (TIA)/limitingamplifier (LA) type of drive circuit. As shown, optical fiber cables1630 include end portions extending into respective thru-holes 1624 viathe rear side of the optical communication mount 1600.

FIG. 17A illustrates a perspective view of a photo detector (PD) and/orvertical-cavity surface-emitting laser (VCSEL) array device 1700 inaccordance with another aspect of the disclosure. The PD and/or VCSELarray device 1700 may be configured to interface with the opticalcommunication mount discussed above. That is, the array device 1700includes one or more PDs and/or VCSELs arranged so that when the arraydevice is mounted on the optical communication mount discussed above,the one or more PDs and/or VCSELs substantially registers with the oneor more thru-holes of the mount.

In particular, the PD and/or VCSEL array 1700 comprises a housing 1702including an array 1704 of PDs and/or VCSEL devices. For example, all ofthe devices in the array 1704 may be PDs. In such configuration, thearray device 1700 may be configured as a receiver. Alternatively, all ofthe devices in the array 1704 may be VCSELs. In such configuration, thearray device 1700 may be configured as a transmitter. Alternatively,some of the devices in the array 1704 may be VCSELs and other devices inthe array may be PDs (e.g., two VCSELs and PDs). In such configuration,the array device 1700 may be configured as a transceiver.

As shown, each device of the array 1704 may comprise an active area1706, a grounding area 1708, and an electrically-conductive trace 1710for routing a bias voltage or current to the active area. When the arraydevice 1700 is interfaced with the optical communication mount, theactive area 1706 of each device of the array 1704 registers with athru-hole of the optical communication mount. Additionally, when thearray device 1700 is interfaced with the mount, theelectrically-conductive trace 1710 makes electrical contact with acorresponding electrically-conductive trace of the mount. As an example,with reference to FIGS. 16 and 17A, a bias voltage or current for adevice of the array 1704 may be routed from a driver 1640 to the activearea 1706 of the device via an electrically-conductive trace 1612 on thePCB or substrate 1610, an electrically-conductive trace 1626 on themount 1620, and the electrically-conductive trace 1710 on the arraydevice 1700.

FIG. 17B illustrates a perspective view of an optical communicationsystem 1750 comprising the optical communication mount 1620 mounted onthe PCB or substrate 1610, and the array device 1700 interfaced with themount 1620 in accordance with another aspect of the disclosure. In suchconfiguration, the devices of the array 1704 of the device 1700 aresubstantially aligned with the optical fibers 1630 via the thru-holes inthe mount 1620, respectively. Thus, signals communicated via the opticalfibers may be processed by the devices of the array. Also, as discussedabove, bias voltages for the devices of the array 1704 may be routedfrom the driver circuit 1640 to the active area 1706 of the devices byway of the electrically-conductive traces 1612 on the PCB or substrate1610, electrically-conductive traces 1626 on the mount 1620, and theelectrically-conductive traces 1710 on the array device 1700.

FIG. 18 illustrates side and front views of another exemplary opticalcommunication mount 1800 in accordance with another aspect of thedisclosure. The mount 1800 is similar to those of the previousembodiments. However, the mount 1800 comprises thru-holes 1804 that aretapered from a rear-side to a front-side of a frame or housing 1802. Thetapering of the thru-holes 1804 is such that the opening on therear-side is wider than the opening on the front-side. This facilitatesthe insertion of an optical fiber 1830 into a thru-hole 1804 by way ofthe rear-side, and allows for a friction fiction fit of the opticalfiber 1830 within the thru-hole 1804 when the end of the optical fiberis lodged within the hole. As in the previous embodiments, the mount1800 includes electrically-conductive traces 1806 for routing biasvoltage or current to the corresponding devices.

FIG. 19 illustrates side and front views of yet another exemplaryoptical communication mount 1900 in accordance with another aspect ofthe disclosure. The mount 1900 is similar to those of the previousembodiments. However, the mount 1900 comprises thru-holes 1904 that arestepped from a rear-side to a front-side of a frame or housing 1902. Thestepping of the thru-holes 1904 is such that the opening on therear-side is wider than the opening on the front-side. This facilitatesthe insertion of an optical fiber 1930 into a thru-hole 1904 by way ofthe rear-side, and allows for a friction fiction fit of the opticalfiber 1930 within the thru-hole 1904 when the end of the optical fiberis lodged within the hole. As in the previous embodiments, the mount1900 includes electrically-conductive traces 1906 for routing biasvoltage or current to the corresponding devices.

FIG. 20 illustrates front and bottom views of still another exemplaryoptical communication mount 2000 in accordance with another aspect ofthe disclosure. The mount 2000 is similar to those of the previousembodiments. However, the mount 2000 comprises an additionalelectrically-conductive trace 2008 disposed on front and bottom sides ofa frame or housing 2002 of the optical communication mount 2000. Thiselectrically-conductive trace 2008 provides ground potential to the PDsand/or VCSELs that are positioned proximate the holes 2004 formedthrough the frame or housing 2002, as previously discussed. Thus, insuch configuration, electrically-conductive traces 2006 and 2008 areconfigured to route bias voltage and ground potential to such devicesfrom a PCB or substrate on which the optical communication mount issecurely attached.

FIG. 21 illustrates front and bottom views of an additional exemplaryoptical communication mount 2100 in accordance with another aspect ofthe disclosure. The mount 2100 is similar to those of the previousembodiments. However, the mount 2100 comprises a frame or housing 2102that includes a raised boundary region 2108 extending vertically alongthe front side and horizontally along the top of the frame or housing.The raised boundary region 2108 defines an internal recessed region2110, which is adapted to receive a PD and/or VCSEL array device, aspreviously discussed.

When positioned within the recess 2110, the sides of the PD and/or VCSELarray device may be flushed with the top and side portions of the raisedboundary region 2108. In this position, the individual devices of thearray device may be substantially aligned with the thru-holes 2104 forefficient reception and/or transmission of signals propagating via theoptical fibers positioned within the holes. Also, in this position, theelectrically-conductive traces on the array device may make electricalcontact to the electrically-conductive traces 2106 on the front side ofthe mount 2100 in order to provide bias voltage from the mount to thearray device.

FIG. 22 illustrates side and bottom views of a further exemplary opticalcommunication mount 2200 in accordance with another aspect of thedisclosure. The mount 2200 is similar to those of the previousembodiments. However, the mount 2200 comprises a frame or housing 2202that includes thereon a driver circuit 2210 (e.g., TIA/LA) forgenerating the appropriate bias voltage for devices of an array devicethat interfaces with the mount. In this regards, the mount 2202comprises an electrically-conductive trace 2212 disposed on the frontside and bottom side (not shown) of the frame or housing 2202. Theelectrically-conductive trace 2212 provides a source voltage or currentto the driver circuit 2210. The driver circuit 2210, in turn, generatesappropriate bias voltages for the devices of the array device from thesource voltage or current, and provides the bias voltage or current tothe devices by way of electrically-conductive traces 2206 disposed onthe front side of the frame or housing 2206. When the array device isinterfaced with the mount 2200, the devices of the array, substantiallyaligned with the thru-holes 2204, receive the bias voltage or currentfrom the integrated driver circuit 2210.

FIG. 23A illustrates a top view of an exemplary wafer 2302 at arelatively early stage of an exemplary method 2300 of manufacturing anoptical communication mount in accordance with another aspect of thedisclosure. As previously mentioned, the wafer 2302 may be made out of asemiconductor or electrically-insulating material, such as silicon,aluminum nitride (AIN), etc. According to the method 2300, a pluralityof via holes 2304 are formed through the wafer 2302. In this example,four (4) mounts are to be formed, each having four (4) holes toconfigure each of them as a four-channel mount. As discussed above, itshall be understood that the mount may be formed with any number ofchannels, and a single wafer may include thousands of mounts. In thisexample, the via holes 2304 are positioned such that pair of mounts aresituated bottom-to-bottom with respect to the other pair of mounts.

FIG. 23B illustrates a top view of the exemplary wafer 2302 at asubsequent stage of the exemplary method 2300 of manufacturing anoptical communication mount in accordance with another aspect of thedisclosure. According to the method 2300, a trench 2306 is formed alongthe common bottom regions of the opposed pair of mounts. The trench 2306is used to form the electrically-conductive traces on the bottom of themounts.

FIG. 23C illustrates a top view of the exemplary wafer 2302 at asubsequent stage of the exemplary method 2300 of manufacturing anoptical communication mount in accordance with another aspect of thedisclosure. According to the method 2300, electrically-conductive traces2308 are formed that extend from proximate the via-holes associated withone of the mount pairs to proximate the via holes associated with theother mount pairs.

FIG. 23D illustrates a top view of the exemplary wafer 2302 at asubsequent stage of the exemplary method 2300 of manufacturing anoptical communication mount in accordance with another aspect of thedisclosure. According to the method 2300, after theelectrically-conductive traces 2308 are formed, the wafer 2302 to dicedalong cut-lines 2310 (shown as dashed lines) to form the four (4)individual mounts. It shall be understood that the method 2300 is merelyone example of forming an optical communication mount described herein,other methods may be used. Also, although for exemplary purposes, thewafer 2302 is shown only to include four (4) mounts, it shall beunderstood that the wafer may include thousands of mounts.

While the invention has been described in connection with variousembodiments, it will be understood that the invention is capable offurther modifications. This application is intended to cover anyvariations, uses or adaptation of the invention following, in general,the principles of the invention, and including such departures from thepresent disclosure as come within the known and customary practicewithin the art to which the invention pertains.

What is claimed is:
 1. A data communications cable, comprising: a firstconnector comprising a first set of one or more electrical contactsconfigured to receive multimedia data from a first device attached tothe first connector; an optical modulator configured to modulate one ormore optical signals with the multimedia data received from the firstdevice; an optical demodulator configured to demodulate the one or moreoptical signals to regenerate the multimedia data; a second connectorcomprising a second set of one or more electrical contacts configured toprovide the regenerated multimedia data to a second device attached tothe second connector; one or more optical waveguides for transmittingthe one or more modulated optical signals from the first connector tothe second connector; and a first port configured to receive a firstpower signal from at least one external device.
 2. The datacommunications cable of claim 1, wherein the first port is coupled tothe second connector.
 3. The data communications cable of claim 1,wherein the second connector comprises the first port.
 4. The datacommunications cable of claim 1, wherein the first port is coupled tothe first connector.
 5. The data communications cable of claim 1,wherein the first connector comprises the first port.
 6. The datacommunications cable of claim 1, further comprising one or more wiresconfigured to route the first power signal from the first connector tothe second connector.
 7. The data communications cable of claim 1,wherein the first port is coupled to the first connector, and furthercomprising a second port coupled to the second connector, wherein thesecond port is configured to receive a second power signal from the atleast one external device.
 8. The data communications cable of claim 1,wherein the first connector comprises the first port, and wherein thesecond connector comprises a second port configured to receive a secondpower signal from the at least one external device.
 9. The datacommunications cable of claim 1, wherein the first port comprises aUniversal Serial Bus (USB) port.
 10. The data communications cable ofclaim 1, wherein the first connector comprises a third set of one ormore electrical contacts configured to receive a second power signalfrom the first device.
 11. The data communications cable of claim 10,further comprising one or more wires configured to route the secondpower signal from the first connector to the second connector.
 12. Thedata communications cable of claim 1, wherein the first connectorcomprises a third set of one or more electrical contacts configured toreceive control data from the first device.
 13. The data communicationscable of claim 12, further comprising one or more wires configured tocommunicate the control data from the first connector to the secondconnector.
 14. The data communications cable of claim 1, wherein thesecond connector comprises a third set of one or more electricalcontacts configured to receive control data from the second device. 15.The data communications cable of claim 14, further comprising one ormore wires configured to communicate the control data from the secondconnector to the first connector.
 16. The data communications cable ofclaim 1, wherein the multimedia data is compliant with a High-DefinitionMultimedia Interface (HDMI) protocol.
 17. A data communications cable,comprising: a first connector comprising a first set of one or moreelectrical contacts configured to receive multimedia data from a firstdevice attached to the first connector; an optical modulator configuredto modulate one or more optical signals with the multimedia datareceived from the first device; an optical demodulator configured todemodulate the one or more optical signals to regenerate the multimediadata; a second connector comprising a second set of one or moreelectrical contacts configured to provide the regenerated multimediadata to a second device attached to the second connector; one or moreoptical waveguides for transmitting the one or more modulated opticalsignals from the first connector to the second connector; and a USB portconfigured to receive a power signal from an external device.
 18. Thedata communications cable of claim 17, wherein the USB port is coupledto the second connector.
 19. The data communications cable of claim 17,wherein the USB port is coupled to the first connector.
 20. The datacommunications cable of claim 19, further comprising one or more wiresconfigured to route the power signal from the first connector to thesecond connector.
 21. A data communications cable, comprising: a firstconnector comprising a first set of one or more electrical contactsconfigured to receive multimedia data from a first device attached tothe first connector; an optical modulator configured to modulate one ormore optical signals with the multimedia data received from the firstdevice; an optical demodulator configured to demodulate the one or moreoptical signals to regenerate the multimedia data; a second connectorcomprising a second set of one or more electrical contacts configured toprovide the regenerated multimedia data to a second device attached tothe second connector; one or more optical waveguides for transmittingthe one or more modulated optical signals from the first connector tothe second connector; a first USB port configured to receive a firstpower signal from at least one external device, wherein the first USBport is coupled to the first connector; and a second USB port configuredto receive a second power signal from the at least one external device,wherein the second USB port is coupled to the second connector.